Notas de ImprensaNotícias

Lian Li lança no mercado caixa 3 em 1 – Odyssey X

Foi na Computex 2019 que a Lian Li deu a conhecer um conceito de caixa que se podia transformar, modificando não só o visual mas o desempenho que cada opção permitia: a Odyssey X. A marca sempre teve dos modelos mais premium do mercado e esta aproximação a um formato futurista de caixa modular. Cada painel transpira qualidade e o sistema está pensado, em conjunto com Der8auer (gamer e overclocker alemão), para o melhor desempenho do mercado. Outra peculiariedade é que cada um dos três formatos da caixa tem compatibilidade diferente, quer no hardware como no cooling. O que achas desta caixa?

Nota de imprensa

LIAN LI Brings Concept Case to Retail with the 3-in-1 All Aluminum Full Tower ODYSSEY X

SILVER ODYSSEY X DYNAMIC / BLACK ODYSSEY X PERFORMANCE

  • Modular case with two orientations and three configurations – Dynamic, Dynamic R, Performance
  • Innovative foldable dark-tinted glass panels
  • Versatile snap-on panels for custom airflow and appearance
  • High-end sandblasted anodized finish
  • Water cooling and large component support – Up to EEB motherboard, 480mm radiator, 6x 140mm fans

June 21st, 2021, Taipei, Taiwan – LIAN LI Industrial Co. Ltd., a leading manufacturer of aluminum chassis and PC accessories, announces the ODYSSEY X, available in full black, and silver/black. The open airflow full tower is built with high-quality aluminum featuring a sandblasted anodized finish with innovative folding glass panels and modular frame, allowing easy transformation to achieve 2 distinctive looks and 3 configurations. Built to house large components, the Odyssey X is geared towards water cooling enthusiasts demanding nothing but the best in quality.

ODYSSEY X DYNAMIC / ODYSSEY X PERFORMANCE / ODYSSEY X DYNAMIC R (ROTATE)

One case 3 configs

The ODYSSEY X is delivered in Dynamic mode straight out of the box, and includes the accessories needed to transform into either a Dynamic-R (rotate) mode for a chimney style setup, or Performance mode for a complete change in orientation and increased airflow. To achieve this level of transformation, each part of the ODYSSEY X has been engineered to serve multiple purposes. The dark-tinted left and right side glass panels feature an edge and hinge design that makes them compatible in both Dynamic and Performance modes while completely transforming the look. When in Performance mode, the same panel design allows for more air circulation in the case, improving the thermal performance of the ODYSSEY X.

Additionally, the modular design allows the motherboard tray, front, top, and bottom panels to be interchanged to achieve the Dynamic-R and Performance modes. To complement the transformable aspect of the case, the front panels of the Dynamic mode, which are positioned at the top in Performance mode, can be flipped to relocate the vent gap either at the center of the front panel or at the edge, simultaneously redirecting the airflow as desired and modifying the appearance and performance of the case.

Water cooling focused

All 3 configurations of the ODYSSEY X can house large high-performance water-cooled components such as motherboards up to EEB, radiator support up to 1x 480mm, fan support up to 9x 120mm or 7x 140mm, and an included pump stand that is removable and adjustable to help users align their tubing perfectly. With power supplies of up to 280mm in length supported, larger high voltage PSUs will fit with ease and style, thanks to the included removable shroud bracket which hides cables and gives the system a clean look.

German gamer and overclocker Der8auer also consulted to ensure the design of the ODYSSEY X is optimized. Thanks to his contribution, the final design of the Odyssey X has been fine-tuned for maximum performance and usability. Available in all black, or silver and black, the ODYSSEY X opens for pre-order starting June 21st, 2021, at MSRP $499.00 USD. For more information, visit the official product page: https://lian-li.com/product/odyssey-x/

Specifications
Product NameLIAN LI ODYSSEY X
ModelTR-01 X / TR-01 A
ColorBlack / Silver
Dimensions (D x W x H)
Dynamic/Dynamic-R (Rotated)575.5mm x 234mm x 558.5mm
Performance537.1mm x 368.6mm x 596.7mm
MaterialAluminum

Steel

4.0mm black tinted tempered glass (both sides)

Motherboard SupportEEB / E-ATX / ATX / M-ATX / ITX
Fan Support
DynamicFront: 3 x 120mm or 2 x 140mm

Top: 3 x 120mm or 2 x 140mm

Side: 3 x 120mm or 2 x 140mm

Dynamic-RFront: 3 x 120mm or 2 x 140mm

Base: 4 x 120mm or 3 x 140mm

PerformanceFront: 4 x 120mm or 3 x 140mm

Top: 3 x 120mm or  2x 140mm

Radiator support
DynamicFront: 1 x 360/280/240mm

Side: 1 x 360/280/240mm

Dynamic-RFront: 1 x 360/280/240mm

Base: 1 x 480/420/360/280/240mm

PerformanceFront: 1 x 480/420/360/280/240mm

Top: 1 x 360/280/240mm

PSUMax 280mm
GPU Length ClearanceMax 423mm
CPU Height ClearanceMax 170mm
Drive3 x 3.5” or 3 x 2.5” HDD/SSD
Expansion slot8
I/O Ports2 x USB 3.0, 1 x USB 3.1 Type-C, 1 x  HD Audio
Warranty1 Year

The LIAN LI ODYSSEY X is now available from Newegg:

https://www.newegg.com/p/pl?d=tr-01&N=50001375

The LIAN LI ODYSSEY X is now available from Caseking:

www.caseking.de/odyssey-x

The LIAN LI ODYSSEY X is now available from Overclockers UK:

https://overclockers.co.uk/odysseyx

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Luís Alves

Luís Alves

Cargo: Chief Executive Officer (CEO)
Naturalidade: Santa Maria da Feira

Sou o moda’a’foca original, um dos guru do modding e tecnologia em Portugal. Desde novo autodidata, sempre gostei de criar, inventar e inovar. Na base tecnológica gosto além do modding, de sistemas de refrigeração a água, hardware e um novo fascínio pela impressão 3D. Considero bastante importante a partilha de conteúdos e conhecimentos.

Desde Abril de 2014 podem também me encontrar na Rubrica PLUG da revista PCGuia todos os meses, a escrever sobre modding, refrigeração a água, pc build e overclocking.

Em Julho de 2017 fundei as Hashtag Dondoca, um projeto sobre saúde mental, agricultura, minimalismo e sustentabilidade, onde sou diretor artístico.

Atualmente no 5º ano do Mestrado Integrado em Engenharia Mecânica na FEUP (especialização Automação), licenciado em Engenharia Mecânica pelo IPV. Trabalhei durante 6 anos como Engenheiro de Processo na área de semicondutores, para clientes no mercado automóvel e de consumo.